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| cmp chemical mechanical polishing: Advances in Chemical Mechanical Planarization (CMP) Babu Suryadevara, 2021-09-10 Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP |
| cmp chemical mechanical polishing: Advances in Chemical Mechanical Planarization (CMP) Babu Suryadevara, 2016-01-09 Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. - Considers techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for particular materials - Addresses consumables and process control for improved CMP |
| cmp chemical mechanical polishing: Chemical-Mechanical Polishing - Fundamentals and Challenges: S. V. Babu, S. Danyluk, M. Krishnan, M. Tsujimura, 2014-06-05 Chemical-mechanical planarization (CMP) has emerged over the past few years as a key enabling technology in the relentless drive of the semiconductor industry towards smaller, faster and less expensive interconnects. However, there are still many gaps in the fundamental understanding of the overall CMP process and the associated defect and contamination issues. This book brings together many of the active players in the field to focus on the interdisciplinary nature of these challenges. It reflects, to some extent, the role played by both academic institutions and multinational corporations in opening up the frontiers in the field of CMP for wider dissemination. Both experimental and theoretical contributions are included. Topics include: overview and oxide polishing; pads and related issues; metal polishing - W and Al; copper polishing and related issues; CMP modeling and fluid flow; and particle adhesion and post-polish cleaning. |
| cmp chemical mechanical polishing: Chemical-Mechanical Planarization of Semiconductor Materials M.R. Oliver, 2004-01-26 This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed. |
| cmp chemical mechanical polishing: Chemical-Mechanical Planarization: Volume 767 Duane S. Boning, 2003-08-27 Chemical-mechanical planarization (CMP) has emerged as a critical fabrication technology for advanced integrated circuits. Even as the applications of CMP have diversified and we have begun to understand aspects of the physics and chemistry of the process, a new generation of CMP innovations is unfolding. New slurries and consumables are under development. New applications to novel devices continue to appear. This book, the most recent in a successful series on CMP, offers a review of the advances to date and provides a comprehensive discussion of the future challenges that must be overcome. Presentations from academia, government labs and industry are featured. Topics include; CMP modeling; CMP science; CMP slurries and particles for planarization of copper, oxide, and other materials; planarization applications including shallow trench isolation (STI), copper damascene, and novel devices and CMP integration. |
| cmp chemical mechanical polishing: Chemical Mechanical Polishing 14 R. Rhoades, G. Banerjee, B. Basim, L. Economikos, D. Huang, Y. Obeng, 2016-09-21 |
| cmp chemical mechanical polishing: Chemical Mechanical Planarization of Microelectronic Materials Joseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann, 2008-09-26 Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP. |
| cmp chemical mechanical polishing: Advances in CMP Polishing Technologies Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa, 2011-12-06 CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan |
| cmp chemical mechanical polishing: Chemical-Mechanical Planarization of Semiconductor Materials M.R. Oliver, 2013-03-14 This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed. |
| cmp chemical mechanical polishing: Chemical-Mechanical Polishing 2001 - Advances and Future Challenges: Suryadevara V. Babu, Kenneth C. Cadien, Hiroyuki Yano, 2014-06-05 With copper and barrier-layer integration firmly in place, several other exciting developments are occurring in the practice of chemical-mechanical polishing (CMP), and many advances are described in this book, first published in 2001. Discussions on CMP for shallow-trench isolation, abrasive-free slurries, improvements in pad and tool configurations including fixed abrasive pads, 'engineered' particles, effects of nanotopography, end-point studies, defect characterization and novel post-CMP cleaning methods are highlighted. Considerable progress has also been reported in modeling the complicated interactions that occur between the wafer surface and the pad and the slurry, whether containing abrasives or abrasive-free, and their influence on dishing and erosion and nonuniformity. These studies offer valuable insights for process improvements and yet many challenges remain and will provide a high level of interest for future books. Topics include: recent developments - pads and related issues; CMP abrasives; copper CMP/STI and planarization; STI and planarization - wear-rate models; low-k and integration issues - particle and process effects in CMP and issues in CMP cleaning. |
| cmp chemical mechanical polishing: Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann, 2013-11-27 As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning. |
| cmp chemical mechanical polishing: Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication Jianfeng Luo, David A. Dornfeld, 2013-03-09 Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an integrated model and, more specifically, we include the important role of the mechanical elements of the process. |
| cmp chemical mechanical polishing: Advances in CMP Polishing Technologies Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa, 2011-11-30 CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field – making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology – the science of friction, wear and lubrication – the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. - Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering - Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments - The authors bring together the latest innovations and research from the USA and Japan |
| cmp chemical mechanical polishing: Semiconductor Manufacturing Handbook Hwaiyu Geng, 2005-05-18 WORLD-CLASS SEMICONDUCTOR MANUFACTURING EXPERTISE AT YOUR FINGERTIPS This is a comprehensive reference to the semiconductor manufacturing process and ancillary facilities -- from raw material preparation to packaging and testing, applying basics to emerging technologies. Readers charged with optimizing the design and performance of manufacturing processes will find all the information necessary to produce the highest quality chips at the lowest price in the shortest time possible. The Semiconductor Manufacturing Handbook provides leading-edge information on semiconductor wafer processes, MEMS, nanotechnology, and FPD, plus the latest manufacturing and automation technologies, including: Yield Management Automated Material Handling System Fab and Cleanroom Design and Operation Gas Abatement and Waste Treatment Management And much more Written by 60 international experts, and peer reviewed by a seasoned advisory board, this handbook covers the fundamentals of relevant technology and its real-life application and operational considerations for planning, implementing, and controlling manufacturing processes. It includes hundreds of detailed illustrations and a list of relevant books, technical papers, and websites for further research. This inclusive, wide-ranging coverage makes the Semiconductor Manufacturing Handbook the most comprehensive single-volume reference ever published in the field. STATE-OF-THE-ART SEMICONDUCTOR TECHNOLOGIES AND MANUFACTURING PROCESSES: SEMICONDUCTOR FUNDAMENTALS How Chips Are Designed and Made * Substrates * Copper and Low-k Dielectrics * Silicide Formation * Plasma * Vacuum * Photomask WAFER PROCESSING TECHNOLOGIES Microlithography * Ion Implantation * Etch * PVD/ALD * CVD * ECD * Epitaxy * CMP * Wet Cleaning FINAL MANUFACTURING Packaging * Grinding, Stress Relief, Dicing * Inspection, Measurement, and Testing NANOTECHNOLOGY, MEMS, AND FPD GAS AND CHEMICALS Specialty Gas System and DCA * Gas Abatement Systems * Chemical and Slurries Delivery System * Ultra Pure Water FAB YIELD, OPERATIONS, AND FACILITIES Yield Management * Automated Materials Handling System * Metrology * Six Sigma * Advanced Process Control * EHS * Fab Design and Construction * Cleanroom * Vibration and Acoustic Control * ESD * Airborne Molecular Control * Particle Monitoring * Wastewater Neutralization Systems |
| cmp chemical mechanical polishing: Chemical Mechanical Polishing in Silicon Processing , 1999-10-29 Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. The Willardson and Beer series, as it is widely known, has succeeded in producing numerous landmark volumes and chapters. Not only did many of these volumes make an impact at the time of their publication, but they continue to be well-cited years after their original release. Recently, Professor Eicke R. Weber of the University of California at Berkeley joined as a co-editor of the series. Professor Weber, a well-known expert in the field of semiconductor materials, will further contribute to continuing the series' tradition of publishing timely, highly relevant, and long-impacting volumes. Some of the recent volumes, such as Hydrogen in Semiconductors, Imperfections in III/V Materials, Epitaxial Microstructures, High-Speed Heterostructure Devices, Oxygen in Silicon, and others promise that this tradition will be maintained and even expanded. Reflecting the truly interdisciplinary nature of the field that the series covers, the volumes in Semiconductors and Semimetals have been and will continue to be of great interest to physicists, chemists, materials scientists, and device engineers in modern industry. |
| cmp chemical mechanical polishing: Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect Jie Cheng, 2017-09-06 This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research. |
| cmp chemical mechanical polishing: Introduction to Microfabrication Sami Franssila, 2005-01-28 Microfabrication is the key technology behind integrated circuits,microsensors, photonic crystals, ink jet printers, solar cells andflat panel displays. Microsystems can be complex, but the basicmicrostructures and processes of microfabrication are fairlysimple. Introduction to Microfabrication shows how the commonmicrofabrication concepts can be applied over and over again tocreate devices with a wide variety of structures andfunctions. Featuring: * A comprehensive presentation of basic fabrication processes * An emphasis on materials and microstructures, rather than devicephysics * In-depth discussion on process integration showing how processes,materials and devices interact * A wealth of examples of both conceptual and real devices Introduction to Microfabrication includes 250 homework problems forstudents to familiarise themselves with micro-scale materials,dimensions, measurements, costs and scaling trends. Both researchand manufacturing topics are covered, with an emphasis on silicon,which is the workhorse of microfabrication. This book will serve as an excellent first text for electricalengineers, chemists, physicists and materials scientists who wishto learn about microstructures and microfabrication techniques,whether in MEMS, microelectronics or emerging applications. |
| cmp chemical mechanical polishing: Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing Robert Leon Opila, L. Zhang, 1998 |
| cmp chemical mechanical polishing: Microelectronic Applications of Chemical Mechanical Planarization Yuzhuo Li, 2007-12-04 An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes. |
| cmp chemical mechanical polishing: Chemical Mechanical Planarization of Microelectronic Materials Joseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann, 1997 The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. |
| cmp chemical mechanical polishing: Abrasive Technology Anna Rudawska, 2018-10-24 The subject matter of this book is the information on the abrasive technology methods, the characteristics of the methods (for example, the technological parameters, tools, and machines), innovative methods, characteristics of surface structure and surface properties after this type of mechanical process, and application in various industrial branches and other technical and technological domains. Abrasive technology is very important, for example, in precision component manufacturing and nano-technology devices. The aim of this book is to present information on the characteristics and applications of abrasive technology, abrasive tools, tests, and also the innovative methods of this technology. This information enables scientists, engineers, and designers to ensure the soundness and integrity of the fabricated components and to develop new techniques effectively. |
| cmp chemical mechanical polishing: Chemical-Mechanical Polishing 2000 - Fundamentals and Materials Issues: Volume 613 Rajiv K. Singh, Rajeev Bajaj, Mansour Moinpour, Marc Meuris, 2001-04-16 Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. Other emerging applications for this technology include flat-panel displays, magnetic data storage and microelectromechanical systems. The rapid emergence of copper as the conducting material for integrated circuits has further pushed CMP technology to the forefront of semiconductor manufacturing. However, a basic understanding of the CMP process, which is necessary to enable further advances, is inadequate. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured. Topics include: CMP mechanisms; dielectric and metal CMP; process integration and manufacturability; and CMP consumables. |
| cmp chemical mechanical polishing: Tribology In Chemical-Mechanical Planarization Hong Liang, David Craven, 2005-03-01 Illustrating their intersecting role in manufacturing and technological development, this book examines tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects as well as friction, lubrication fundamentals, and the basics of wear. The book concludes its focus with mechanical aspects of CMP, pad materials, elastic modulus, and cell buckling. As the first source to integrate CMP and tribology, Tribology in Chemical-Mechanical Planarization provides applied scientists and engineers in the fields of semiconductors and microelectronics with clear foresight to the future of this technology. |
| cmp chemical mechanical polishing: Chemical-Mechanical Planarization: Volume 867 A. Kumar, 2005-07-19 Technology requirements associated with the progressive scaling of devices for future technology nodes, coupled with the aggressive introduction of new materials, places tremendous demands on chemical-mechanical polishing. The goal of this 2005 book, which is part of a popular series from MRS, is to bring together experts from a broad spectrum of research and technology groups currently working on CMP, to review advances made, and to offer a comprehensive discussion of future challenges that must be overcome. The book shows trends in the development of consumables, process modules, tool designs, process integration, modeling, defect characterization, and metrology. Topics include: planarization processes and applications; consumables -CMP pads and slurries; CMP equipment and metrology; and CMP modeling and simulation. |
| cmp chemical mechanical polishing: Particle Adhesion David J. Quesnel, Ronald S. Rimai, Louis H. Sharpe, 2002-02-07 Whenever a curved surface interacts with another surface, the principles of adhesion are at work. From the cells in your body to the dust on your glasses, intermolecular forces cause materials to attract one another. Elastic deformations resulting from these adhesive interactions store strain that can be liberated during particle detachment. Time dependent changes in adhesion can result from plastic deformation that both increases the real effective contact area and reduces the stored energy available to assist in particle removal. Processes such as these, based on the fundamentals tenets of particle adhesion, are now finding applications across many disciplines leading to a rich and rapid development of knowledge. This book documents the use of particle adhesion concepts in a variety of disciplines. Fields as varied as the cleaning of semiconductors, to the controlling of cancer metastasis, to the abatement of environmental pollution all benefit from applications of particle adhesion concepts. |
| cmp chemical mechanical polishing: Nanoparticle Engineering for Chemical-Mechanical Planarization Ungyu Paik, Jea-Gun Park, 2019-04-15 In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progressively becomes perceived less as black art and more as a cutting-edge technology, it is emerging as the technology for achieving higher performance devices. Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties of nanoparticles according to each step in the CMP process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. They present design techniques using polymeric additives to improve CMP performance. The final chapter focuses on novel CMP slurry for the application to memory devices beyond 50nm technology. Most books published on CMP focus on the polishing process, equipment, and cleaning. Even though some of these books may touch on CMP slurries, the methods they cover are confined to conventional slurries and none cover them with the detail required for the development of next-generation devices. With its coverage of fundamental concepts and novel technologies, this book delivers expert insight into CMP for all current and next-generation systems. |
| cmp chemical mechanical polishing: Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication Jianfeng Luo, David Dornfeld, 2014-03-12 Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an integrated model and, more specifically, we include the important role of the mechanical elements of the process. |
| cmp chemical mechanical polishing: Metallization S. P. Murarka, 1993 This title covers fundemental concepts, properties and applicabilities of metals and alloys for use in various metallization schemes. Metallizations form the key components on electronic circuits - controlling device properties and providing power and device interconnections with the outside world or with other devices. The recent advent of submicron dimensions and increasingly faster devices in the semiconductor have challenged researchers to keep metallization schemes in line with new demanding requirements. |
| cmp chemical mechanical polishing: Polishing of Diamond Materials Yiqing Chen, Liangchi Zhang, 2013-02-13 Diamond has a unique combination of properties, such as the highest hardness and thermal conductivity among any known material, high electrical resistivity, a large optical band gap and a high transmission, good resistance to chemical erosion, low adhesion and friction, and extremely low thermal expansion coefficient. As such, diamond has been a desirable material in a wide range of applications in mechanical, chemical, optical, thermal and electrical engineering. In many of the cases, the surface of a diamond component or element must have a superior finish, often down to a surface roughness of nanometers. Nevertheless, due to its extreme hardness and chemical inertness, the polishing of diamond and its composites has been a sophisticated process. Polishing of Diamond Materials will provide a state-of-the-art analysis, both theoretically and experimentally, of the most commonly used polishing techniques for mono/poly-crystalline diamond and chemical vapour deposition (CVD) diamond films, including mechanical, chemo-mechanical, thermo-chemical, high energy beam, dynamic friction and other polishing techniques. The in-depth discussions will be on the polishing mechanisms, possible modelling, material removal rate and the quality control of these techniques. A comparison of their advantages and drawbacks will be carried out to provide the reader with a useful guideline for the selection and implementation of these polishing techniques. Polishing of Diamond Materials will be of interest to researchers and engineers in hard materials and precision manufacturing, industry diamond suppliers, diamond jewellery suppliers and postgraduate students in the area of precision manufacturing. |
| cmp chemical mechanical polishing: Handbook of Lapping and Polishing Ioan D. Marinescu, Eckart Uhlmann, Toshiro Doi, 2006-11-20 Lapping and polishing are currently the most precise surface finishing processes for mechanical and electronic components. Unfortunately, most improvements in either methods or understanding of the physical processes involved are closely guarded as proprietary information. The Handbook of Lapping and Polishing is the first source in English to brin |
| cmp chemical mechanical polishing: Tribocorrosion Anna Igual Munoz, Nuria Espallargas, Stefano Mischler, 2020-06-16 This book is a toolbox for identifying and addressing tribocorrosion situations from an engineering point of view. It is an accessible and introductory guideline to the emerging and interdisciplinary field of tribocorrosion covering the main concepts of tribology and corrosion. It describes specific tribocorrosion concepts, models and experimental techniques as well as their application to practical situations in which mechanical and chemical phenomena act simultaneously. |
| cmp chemical mechanical polishing: Characterization of Liquids, Nano- and Microparticulates, and Porous Bodies using Ultrasound Andrei S. Dukhin, Philip J. Goetz, 2010-06-03 Two key words define the scope of this book: 'ultrasound' and 'colloids'. Historically, there has been little real communication between practitioners in these two fields. Although there is a large body of literature devoted to ultrasound phenomenon in colloids, there is little recognition that such phenomena may be of real importance for both the development and applications of colloid science. On the other side, colloid scientists have not embraced acoustics as an important tool for characterizing colloids. The lack of any serious dialogue between these scientific fields is the biggest motivation behind this book. - Covers in detail this multidisciplinary field combining acoustics, electroacoustics, colloid science, analytical chemistry and rheology - Provides a bibliography with more than 1,000 references - Presents theories and their experimental verification, as well as analysis of the methods and hardware pertaining to applications such as pharmaceuticals, ceramics, and polymers |
| cmp chemical mechanical polishing: Chemical Mechanical Polishing 10 G. Banerjee, 2009-05 The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Chemical Mechanical Polishing 10¿, held during the 215th meeting of The Electrochemical Society, in San Francisco, California from May 24 to 29, 2009. |
| cmp chemical mechanical polishing: Tribocorrosion of Passive Metals and Coatings D Landolt, S Mischler, 2011-10-12 Tribocorrosion causes the degradation or alteration of materials through the combined action of corrosion and wear. It limits the performance and life-time of installations, machines and devices with moving parts, and controls certain manufacturing processes such as chemical–mechanical polishing. The effects of tribocorrosion are most pronounced on passive metals which owe their corrosion resistance to a thin protecting oxide film. Most corrosion-resistant engineering alloys belong to this category.This book provides an introduction to the developing field of tribocorrosion and an overview of the latest research. Part one reviews basic notions of corrosion and tribology, before presenting the most recent results on the growth and structure of passive oxide films. Tribocorrosion mechanisms under fretting, sliding and erosion conditions, respectively, are then discussed. Part two focuses on methods for measuring and preventing tribocorrosion. It includes chapters on electrochemical techniques, the design of tribocorrosion test equipment, data evaluation and the optimisation of materials' properties for tribocorrosion systems. Part three presents a selection of tribocorrosion problems in engineering and medicine. Three chapters address the tribocorrosion of medical implants including test methods and clinical implications. Other chapters examine tribocorrosion issues in nuclear power plants, marine environments, automotive cooling circuits, elevated-temperature metal working and chemical–mechanical polishing.With its distinguished editors and international team of expert contributors Tribocorrosion of passive metals and coatings is an invaluable reference tool for engineers and researchers in industry and academia confronted with tribocorrosion problems. - Comprehensively reviews current research on the tribocorrosion of passive metals and coatings, with particular reference to the design of tribocorrosion test equipment, data evaluation and the optimisation of materials' properties for tribocorrosion systems - Chapters discuss tribocorrosion mechanisms under fretting, sliding and erosion conditions before focussing on methods for measuring and preventing tribocorrosion - Includes a comprehensive selection of tribocorrosion problems in engineering and medicine, such as the tribocorrosion of medical implants, and tribocorrosion issues in nuclear power plants, marine environments, automotive cooling circuits and elevated-temperature metal working |
| cmp chemical mechanical polishing: Life-Cycle Assessment of Semiconductors Sarah B. Boyd, 2011-10-12 Life-Cycle Assessment of Semiconductors presents the first and thus far only available transparent and complete life cycle assessment of semiconductor devices. A lack of reliable semiconductor LCA data has been a major challenge to evaluation of the potential environmental benefits of information technologies (IT). The analysis and results presented in this book will allow a higher degree of confidence and certainty in decisions concerning the use of IT in efforts to reduce climate change and other environmental effects. Coverage includes but is not limited to semiconductor manufacturing trends by product type and geography, unique coverage of life-cycle assessment, with a focus on uncertainty and sensitivity analysis of energy and global warming missions for CMOS logic devices, life cycle assessment of flash memory and life cycle assessment of DRAM. The information and conclusions discussed here will be highly relevant and useful to individuals and institutions. |
| cmp chemical mechanical polishing: Novel Aspects of Diamond Nianjun Yang, 2014-11-03 This book focuses on new research fields of diamond, from its growth to applications. It covers growth of atomically flat diamond films, properties and applications of diamond nanoparticles, diamond nanoparticles based electrodes and their applications for energy storage and conversion (supercapacitors, CO2 conversion etc.). Diamond for biomimetic interface, all electrochemical devices for in vivo detections and photo-electrochemical degradation of environmental hazards are highlighted. |
| cmp chemical mechanical polishing: Physics of Semiconductor Devices J.-P. Colinge, C.A. Colinge, 2007-05-08 Physics of Semiconductor Devices covers both basic classic topics such as energy band theory and the gradual-channel model of the MOSFET as well as advanced concepts and devices such as MOSFET short-channel effects, low-dimensional devices and single-electron transistors. Concepts are introduced to the reader in a simple way, often using comparisons to everyday-life experiences such as simple fluid mechanics. They are then explained in depth and mathematical developments are fully described. Physics of Semiconductor Devices contains a list of problems that can be used as homework assignments or can be solved in class to exemplify the theory. Many of these problems make use of Matlab and are aimed at illustrating theoretical concepts in a graphical manner. |
| cmp chemical mechanical polishing: Particle Adhesion and Removal K. L. Mittal, Ravi Jaiswal, 2015-01-06 The book provides a comprehensive and easily accessible reference source covering all important aspects of particle adhesion and removal. The core objective is to cover both fundamental and applied aspects of particle adhesion and removal with emphasis on recent developments. Among the topics to be covered include: 1. Fundamentals of surface forces in particle adhesion and removal. 2. Mechanisms of particle adhesion and removal. 3. Experimental methods (e.g. AFM, SFA,SFM,IFM, etc.) to understand particle-particle and particle-substrate interactions. 4. Mechanics of adhesion of micro- and nanoscale particles. 5. Various factors affecting particle adhesion to a variety of substrates. 6. Surface modification techniques to modulate particle adhesion. 7. Various cleaning methods (both wet & dry) for particle removal. 8. Relevance of particle adhesion in a host of technologies ranging from simple to ultra-sophisticated. |
| cmp chemical mechanical polishing: Handbook for cleaning/decontamination of surfaces Ingegard Johansson, P. Somasundaran, 2007-06-20 The focus of Handbook for Cleaning/Decontamination of Surfaces lies on cleaning and decontamination of surfaces and solid matter, hard as well as soft. Bringing together in a 2-volume reference source: - current knowledge of the physico-chemical fundamentals underlying the cleaning process; - the different needs for cleaning and how these needs are met by various types of cleaning processes and cleaning agents, including novel approaches; - how to test that cleaning has taken place and to what extent; - the effects of cleaning on the environment; - future trends in cleaning and decontamination, for example the idea of changing surfaces, to hinder the absorbance of dirt and thus make cleaning easier.A brief introduction is given to the legal demands concerning the environment and a historical background, in terms of development of detergents, from soaps to the modern sophisticated formulations. Bactericides, their use and the environmental demands on them are covered. Thorough discussions of mechanisms for cleaning are given in several chapters, both general basic concepts and special cases like particle cleaning and cleaning using microemulsion concepts.* General understanding of how cleaning works, function of ingredients and formulations * Overview of environmental issues and demands from the society in the area * Gives basic formulas for cleaning preparations in most areas |
| cmp chemical mechanical polishing: Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann, 2014-09-01 |
CHAPTER 1 INTRODUCTION - MIT
The Chemical Mechanical Polishing (CMP) process has emerged as a critical technique to smooth surface topography. Additionally, new materials such as Cu and W, introduced in ULSI …
The Inception of Chemical Mechanical Polishing
There should be no doubt that without Chemical Mechanical Polishing for the planarization of thin films on semiconductor wafers and MEMS devices and other nanotechnology applications, the …
ADVANCED PROCESS CONTROL IN DIELECTRIC …
Introduction As device dimensions continue to scale down, chemical mechanical polishing (CMP) is becoming more and more critical in the process flow. Scaling of the device dimension not …
CHEMICAL MECHANICAL POLISHING: AN ENABLING …
Chemical-Mechanical-Polishing (CMP), first used as a planarization technology in the manufacture of multi-level metal interconnects for high-density Integrated Circuits (IC), is …
Chemical mechanical polishing: Theory and experiment
In this paper, we review the main factors, key challenges, and technologies of CMP. Theoretical models will be introduced from the viewpoint of the atomic scale, particle scale, and wafer …
Chemical Mechanical Polishing (CMP) - EHWA DIA
EHWA CVD CMP Conditioner Technology ㆍ‘Near-zero’ diamond tip height flatness technology to maximize disk lifetime and minimize wafer defect and topography from lower pad surface …
Mechanics, Mechanisms and Modeling of the Chemical …
narization techniques,the Chemical Mechanical Pol-ishing (CMP) process produces excellent local and global planarization at low cost,and is thus widely adopted in many back-end …
CHAPTER 2 CHARACTERIZATION AND OPTIMIZATION …
In the Chemical Mechanical Polishing (CMP) process used for microelectronics manufacturing, three contact regimes between the wafer surface and the polishing pad may be proposed: …
Chemical-mechanical polishing: enhancing the …
Nov 2, 2021 · The intent of this paper is to overview the benefits of wafer planarization by chemical-mechanical-polishing (CMP) for MicroElectroMechanical Systems MEMS fabrication. …
Chemical Mechanical PolishingChemical Mechanical …
Chemical Mechanical Polishing (()CMP) is a critical step in integrated circuit (IC) manufacturing, typically used for pliilanarizing: • Dielectric materials: SiO2 • C d (C ) d (W)Conductors: copper …
Chemical Mechanical Polishing (CMP) - ehwadia.com
EHWA CVD CMP Conditioner Technology ㆍTechnical excellency in dishing control by CVD disk 1) Excellent diamond tip height uniformity can lead to a smoother and consistent pad surface …
A model for chemical–mechanical polishing of a material …
With the advent of shallow trench isolation (STI) and copper interconnects, chemical– mechanical polishing (CMP) has emerged as one of the most important operations in the fabrication of …
Mechanical Aspects of the Chemical Mechanical Polishing
Chemical mechanical polishing (CMP) is an essential semiconductor manufacturing process because of its local and global planarization ability in fabricating highly integrated devices. The …
Chemical Mechanical Polishing Mechanism of Silicon Nitride …
In this presentation, we reported the chemical mechanical polishing (CMP) mechanisms of silicon nitride surface by ceria abrasive grains. We performed two simulations using first-principles …
Chapter 12 Chemical Mechanical Polishing - eLearning
• CMP reduce defect density, improve yield –Reducing the process problems in thin film deposition, photolithography, and etch. • CMP also widens IC chip design parameters • CMP …
SYSTEMATIC YIELD - CHEMICAL MECHANICAL …
100 Systematic Yield - Chemical Mechanical Polishing (CMP) In this chapter we will start with a brief description of the Dual Damascene process followed by a more detailed description of the …
Recent developments and applications of chemical …
Chemical mechanical polishing (CMP) is considered the only process to attain global planarization [1] and thus has been widely accepted [2, 3] for obtaining ultrasmooth and flat sur-faces [4–6]. …
Technological Advances and Challenges in Chemical …
CMP is considered to be a wet polishing technique that has the capability to generate ultrafine surfaces for numerous materials using the combined effect of chemical and mechanical …
Chemical Mechanical Polishing (CMP) - Cornell University
This document is intended to introduce the techniques of Chemical Mechanical Polishing (CMP) to the new user so that they may be better prepared to integrate CMP into their process flow.
Chapter 12 Chemical Mechanical Polishing - miun.se
Advantages of CMP • CMP reduce defect density, improve yield – Reducing the process problems in thin film deposition, photolithography, and etch. • CMP also widens IC chip design …
CHAPTER 1 INTRODUCTION - MIT
The Chemical Mechanical Polishing (CMP) process has emerged as a critical technique to smooth surface topography. Additionally, new materials such as Cu and W, introduced in ULSI …
The Inception of Chemical Mechanical Polishing
There should be no doubt that without Chemical Mechanical Polishing for the planarization of thin films on semiconductor wafers and MEMS devices and other nanotechnology applications, the …
ADVANCED PROCESS CONTROL IN DIELECTRIC CHEMICAL …
Introduction As device dimensions continue to scale down, chemical mechanical polishing (CMP) is becoming more and more critical in the process flow. Scaling of the device dimension not …
CHEMICAL MECHANICAL POLISHING: AN ENABLING …
Chemical-Mechanical-Polishing (CMP), first used as a planarization technology in the manufacture of multi-level metal interconnects for high-density Integrated Circuits (IC), is …
Chemical mechanical polishing: Theory and experiment
In this paper, we review the main factors, key challenges, and technologies of CMP. Theoretical models will be introduced from the viewpoint of the atomic scale, particle scale, and wafer …
Chemical Mechanical Polishing (CMP) - EHWA DIA
EHWA CVD CMP Conditioner Technology ㆍ‘Near-zero’ diamond tip height flatness technology to maximize disk lifetime and minimize wafer defect and topography from lower pad surface …
Mechanics, Mechanisms and Modeling of the Chemical …
narization techniques,the Chemical Mechanical Pol-ishing (CMP) process produces excellent local and global planarization at low cost,and is thus widely adopted in many back-end …
CHAPTER 2 CHARACTERIZATION AND OPTIMIZATION OF THE …
In the Chemical Mechanical Polishing (CMP) process used for microelectronics manufacturing, three contact regimes between the wafer surface and the polishing pad may be proposed: …
Chemical-mechanical polishing: enhancing the …
Nov 2, 2021 · The intent of this paper is to overview the benefits of wafer planarization by chemical-mechanical-polishing (CMP) for MicroElectroMechanical Systems MEMS fabrication. …
Chemical Mechanical PolishingChemical Mechanical …
Chemical Mechanical Polishing (()CMP) is a critical step in integrated circuit (IC) manufacturing, typically used for pliilanarizing: • Dielectric materials: SiO2 • C d (C ) d (W)Conductors: copper …
Chemical Mechanical Polishing (CMP) - ehwadia.com
EHWA CVD CMP Conditioner Technology ㆍTechnical excellency in dishing control by CVD disk 1) Excellent diamond tip height uniformity can lead to a smoother and consistent pad surface …
A model for chemical–mechanical polishing of a material …
With the advent of shallow trench isolation (STI) and copper interconnects, chemical– mechanical polishing (CMP) has emerged as one of the most important operations in the fabrication of …
Mechanical Aspects of the Chemical Mechanical Polishing …
Chemical mechanical polishing (CMP) is an essential semiconductor manufacturing process because of its local and global planarization ability in fabricating highly integrated devices. The …
Chemical Mechanical Polishing Mechanism of Silicon Nitride …
In this presentation, we reported the chemical mechanical polishing (CMP) mechanisms of silicon nitride surface by ceria abrasive grains. We performed two simulations using first-principles …
Chapter 12 Chemical Mechanical Polishing - eLearning
• CMP reduce defect density, improve yield –Reducing the process problems in thin film deposition, photolithography, and etch. • CMP also widens IC chip design parameters • CMP …
SYSTEMATIC YIELD - CHEMICAL MECHANICAL POLISHING …
100 Systematic Yield - Chemical Mechanical Polishing (CMP) In this chapter we will start with a brief description of the Dual Damascene process followed by a more detailed description of …
Recent developments and applications of chemical …
Chemical mechanical polishing (CMP) is considered the only process to attain global planarization [1] and thus has been widely accepted [2, 3] for obtaining ultrasmooth and flat sur-faces [4–6]. …
Technological Advances and Challenges in Chemical …
CMP is considered to be a wet polishing technique that has the capability to generate ultrafine surfaces for numerous materials using the combined effect of chemical and mechanical …
